X-ray machine for Electronics AX8400

Introducing the AX8400 industrial x-ray equipment, cutting-edge equipment designed with nothing short of quality in mind. This machine incorporates high resolution and high magnification features. The model was first brought into the market in late 2016. This release was made following customers’ demands for additional functionalities. The Ax8400 comes packed with special inspection capabilities and is quite adapted for electronic connector module inspection, printed circuit board solder joint inspection, and flip-chip inspection. It is used for ceramic products, large circuit boards, solar panels, semiconductors, CSP, BGA, battery testing, as well as packaging components. This machine is super optimized and its automatic CNC programming makes highly accurate conclusions.

SAFE TESTING OF EQUIPMENT:

The AX8400 has passed all proscribed standard safety requirements to meet the desires of our respectable client base.

Our products which are quite the pick of the litter make great use of lead glass, thicker lead plates as well as lead-containing rubber. Safety is our watchword and we are uncompromising on quality and high standards. We maintain strict adherence to FDA certification standards.

PRODUCT SPECIFICATIONS:

• The AX8400 is equipped with a 90KV / 100KV-5 micron X-ray source
• The AX8400 has very high-definition X-ray images.
• AX8400 can inspect the parts from different angles by using a +- 60° rotating platform
• AX8400 can measure the size of defects base on the X-ray image, which can help engineers understand the defects more accurately
• The AX8400 uses a Windows platform, so if the customer encounters software problems, the user can connect to the Internet and we can control it remotely.
• The AX8400 uses large navigation window, make the operator easy to locate and identify the defect on products
• The automatic BGA X-ray Inspection program accurately detects each BGA bubble, judges according to customer needs, and outputs an Excel report

APPLICATIONS:

• Electronic connector (harness, cable, plug, etc.)
• PCB solder joint inspection (CSP, BGA, POP and other components inspection)
• LED detection
• Solar photovoltaic (silicon solder joint inspection)
• Electronic module detection
• Semiconductor (package component inspection)
• Ceramic products testing
• Inspection of special industries such as aviation components

BGA Testing

QFN Testing

X-ray machine AX8400 measures distance

 X-ray machine AX8400 auto inspection by CNC programming

X-ray machine AX8400 with a rotating platform

PRODUCT PARAMETERS:

If you want the updated and optimized version of AX8400, AX8400P is the choice for you. It is equipped with intelligent software for producing better image quality, and you can also acquire precise inspection analysis. Go straight and have a check!